PRODUCTS

Arerberte Technology Japan Co., LTD. has established a comprehensive framework capable of providing integrated support for various automation equipment and precision devices, spanning from initial design and development through to manufacturing, installation, and ongoing maintenance.
The company also accommodates flexible customizations to support device development and production across a diverse range of industrial sectors.
Leveraging extensive track records in device development and manufacturing expertise—cultivated primarily within the electronics, LCD panel, and semiconductor industries—the company utilizes its proprietary technologies to deliver tailored OEM and ODM solutions.
These systems achieve labor savings, enhanced production efficiency, and stable quality, contributing to the optimization of production lines.

Panel inspection systems

Automated transfer and loading/unloading equipment

Semiconductor electrical characteristics (temperature) inspection equipment
3-in-1 Lamination, Pressurization, and Bending Device
Utilizing a multi-station configuration, this system automates every step from automatic feeding, lamination, and separation to thermal compression, pressure retention, bending, and discharge. It enhances production efficiency while stabilizing product quality.
Optical Chip Eutectic Die Bonder (Mounting Device)
Capable of handling mounting and bonding processes for power semiconductors, sensors, memories, laser chips, and optical chips. High-precision vision positioning and bonding technologies achieve extremely precise chip placement.
RXTX-ZBlock Dual-Station Automatic Mounting Machine
An automated mounting system designed for optical module manufacturing. Equipped with a multi-axis precision motion system and image positioning technology, it automates processes such as adhesive dispensing, UV curing, and automated transfer.
Click here for inquiries about this product/service.